Tsmc Samsung Intel Others Join Forces For Next Gen Chip Tech
The new standard is dubbed Universal Chiplet Interconnect Express (UCIe), Nikkei Asia reports. It is an advanced ecosystem with a complete “die-to-die interconnect standard” that will make it easier for chipmakers to mix and match chip components (die is an individual chip before packaging). This will allow companies to build custom SoCs (systems-on-a-chip) using parts and components from different vendors. Semiconductor industry heavyweights are jointly working on advanced chip technologies Semiconductor industry heavyweights are jointly working on advanced chip technologies...